Antenna package structure and antenna packaging method

ABSTRACT

The present disclosure provides an antenna package structure and an antenna packaging method for a semiconductor chip. The package structure includes an antenna circuit chip, a first rewiring layer, an antenna structure, a second metal connecting column, a second packaging layer, a second antenna metal layer, and a second metal bump. The antenna circuit chip, the antenna structure, and the second antenna metal layer are interconnected by using two rewiring layers and two layers of metal connecting columns.

CROSS REFERENCES TO RELATED APPLICATIONS

This application claims the benefit of priority to Chinese PatentApplication No. CN2018102175704, entitled “Antenna Package Structure andAntenna Packaging Method”, filed with SIPO on Mar. 16, 2018, and ChinesePatent Application No. CN2018203593267, entitled “Antenna PackageStructure”, filed with SIPO on Mar. 16, 2018, the contents of which areincorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the technical field of semiconductorpackaging, and in particular, to an antenna package structure and anantenna packaging method.

BACKGROUND

Various high-tech electronic products have been developed to bringconvenience to users, including various electronic devices such aslaptops, mobile phones, and portable Android devices (PAD), etc.

Increased demands for these popular high-tech electronic products haveenabled more functions and applications configured into these high-techproducts. In addition, to meet the need for mobilization, the functionof wireless communication is provided. Thus, users can access thehigh-tech electronic devices with the function of wireless communicationanywhere or any time. This greatly increases the flexibility andconvenience in use of these high-tech electronic products. Therefore,users no longer have to be confined to a certain area, and can enjoy theconvenience brought by these electronic products.

In general, existing antenna structures in IC devices usually have manytypes, for examples, they are dipole antenna, monopole antenna, patchantenna, planar inverted-F antenna, meander line antenna, inverted-Lantenna, loop antenna, spiral antenna and spring antenna. A knownpractice is to manufacture an antenna directly on the surface of acircuit board. By this practice, an antenna occupies an extra space ofthe circuit board, thereby resulting in a low integration level. Forvarious electronic devices, a large circuit board means a large size.However, the main purpose of designing and developing these electronicdevices is to allow users to carry them easily. Therefore, how to reducethe area of the circuit board occupied by an antenna, and improve theintegration performance of an antenna packaging structure is the key tosolve the problems of these electronic devices.

In addition, an existing antenna package has typically a single-layerstructure, but this structure has with low antenna efficiency, andcannot meet the increasing demand for antenna performance.

Based on the above, it is necessary to provide a packaging structure andpackaging method for an antenna with a high integration level and highefficiency.

SUMMARY

The present disclosure provides an antenna package structure. Thepackage structure comprises: a first rewiring layer, where the firstrewiring layer comprises a first surface connected to the firstpackaging layer and a second surface opposite to the first surface; anantenna structure, comprising a first packaging layer, a first antennametal layer, a second rewiring layer, and a first metal bump, where thefirst antenna metal layer is disposed on a first surface of the firstpackaging layer, the second rewiring layer is disposed on a secondsurface of the first packaging layer, the first antenna metal layer iselectrically connected to the second rewiring layer by a first metalconnecting column passing through the first packaging layer, the firstmetal bump is formed on the second rewiring layer, and bonded to thesecond surface of the first rewiring layer; a second metal connectingcolumn, formed on the second surface of the first rewiring layer, wherethe second metal connecting column is not lower than a top surface ofthe antenna structure; a second packaging layer, wrapping the antennastructure and the second metal connecting column, where the second metalconnecting column is exposed from a top surface of the second packaginglayer; a second antenna metal layer, formed on the top surface of thesecond packaging layer, where the second antenna metal layer isconnected to the second metal connecting column; an antenna circuitchip, bonded to the first surface of the first rewiring layer; and asecond metal bump, formed on the first surface of the first rewiringlayer, to achieve electrical lead-out of the first rewiring layer.

Preferably, the material of the first packaging layer comprises one ofpolyimide (PI), silica gel, and epoxy resin, and the material of thesecond packaging layer comprises one of PI, silica gel, and epoxy resin.

Preferably, the first rewiring layer comprises a patterned dielectriclayer and a patterned metal wiring layer.

Preferably, the second rewiring layer comprises a first patterneddielectric layer, a patterned metal wiring layer, and a second patterneddielectric layer which are sequentially stacked, and the first metalbump passes through the patterned second dielectric layer and isconnected to the patterned metal wiring layer.

Preferably, the material of the dielectric layer comprises one or acombination of epoxy resin, silica gel, PI, PBO, BCB, silica,phosphosilicate glass, and fluorine-containing glass, and the materialof the metal wiring layer comprises one or a combination of copper,aluminum, nickel, gold, silver, and titanium.

Preferably, the material of the first metal connecting column and thesecond metal connecting column comprises one of Au, Ag, Cu, and Al.

Preferably, a material of the first metal bump and the second metal bumpeach comprises one of a tin solder, a silver solder, and a gold-tinalloy solder.

Preferably, the width of the first rewiring layer is greater than thewidth of the antenna structure, and the second metal connecting columnis distributed on the second surface of the first rewiring layer at theperiphery of the antenna structure.

Preferably, the second antenna metal layer has a window in an areaaligned with the first antenna metal layer, to prevent the secondantenna metal layer from blocking the first antenna metal layer.

The present disclosure further provides an antenna packaging method. Thepackaging method comprises steps of: 1) providing a first supportsubstrate, and forming a separation layer on the first supportsubstrate; 2) forming a first rewiring layer on the separation layer,where the first rewiring layer comprises a first surface connected tothe separation layer and a second surface opposite to the first surface;3) providing an antenna structure, where the antenna structure comprisesa first packaging layer, a first antenna metal layer, a second rewiringlayer, and a first metal bump, where the first antenna metal layer isdisposed on a first surface of the first packaging layer, the secondrewiring layer is disposed on a second surface of the first packaginglayer, the first antenna metal layer is electrically connected to thesecond rewiring layer by a first metal connecting column passing throughthe first packaging layer, and the first metal bump is formed on thesecond rewiring layer; 4) bonding the second surface of the firstrewiring layer to the first metal bump; 5) forming a second metalconnecting column on the second surface of the first rewiring layer,where the second metal connecting column is not lower than a top surfaceof the antenna structure; 6) wrapping the antenna structure by using asecond packaging layer, performing planarization treatment on a surfaceof the second packaging layer, to expose a top surface of the secondmetal connecting column from the second packaging layer; 7) forming asecond antenna metal layer on the surface of the second packaging layer,where the second antenna metal layer is connected to the second metalconnecting column; 8) stripping off the separation layer and removingthe first support substrate, to expose the first surface of the firstrewiring layer; 9) providing an antenna circuit chip, and bonding theantenna circuit chip to the first surface of the first rewiring layer;and 10) forming a second metal bump on the first surface of the firstrewiring layer, to achieve electrical lead-out of the first rewiringlayer.

Preferably, the first support substrate comprises one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate, the separation layer comprises oneof an adhesive tape and a polymer layer, and the polymer layer is firstcoated on a surface of the first support substrate by using aspin-coating process, and then is cured by using an ultra-violet curingprocess or a thermal curing process.

Preferably, the step 2) of manufacturing the first rewiring layercomprises steps: 2-1) forming a dielectric layer on a surface of theseparation layer by using a chemical vapor deposition process or aphysical vapor deposition process, and etching the dielectric layer topattern the dielectric layer; and 2-2) forming a metal layer on asurface of the patterned dielectric layer by using a chemical vapordeposition process, an evaporation process, a sputtering process, anelectroplating process, or an electroless plating process, and etchingthe metal layer to pattern the metal wiring layer.

Further, the material of the dielectric layer comprises one or acombination of epoxy resin, silica gel, PI, PBO, BCB, silica,phosphosilicate glass, and fluorine-containing glass, and the materialof the metal wiring layer comprises one or a combination of copper,aluminum, nickel, gold, silver, and titanium.

Preferably, the step 3) of providing the antenna structure comprises:3-1) providing a second support substrate, and forming a stripping layeron the second support substrate; 3-2) forming a first antenna metallayer on the stripping layer, and forming a first metal connectingcolumn on the first antenna metal layer; 3-3) wrapping the first antennametal layer and the first metal connecting column by using a secondpackaging layer, and performing planarization treatment on the secondpackaging layer, to expose the first metal connecting column; 3-4)forming a second rewiring layer on the second packaging layer, andforming a first metal bump on the second rewiring layer; 3-5) separatingthe second support substrate from the second packaging layer based onthe stripping layer, to expose the first antenna metal layer; and 3-6)performing cutting to form individual antenna structures.

Preferably, in the step 5), the second metal connecting column ismanufactured by using wire bonding, where the wire bonding processcomprises one of a thermal compression wire bonding process, anultrasonic wire bonding process, and a thermal compression ultrasonicwire bonding process, and the material of the second metal connectingcolumn comprises one of Au, Ag, Cu, and Al.

Preferably, in the step 6), a method for packaging the antenna chip byusing the second packaging layer comprises one of compression molding,transfer molding, liquid seal molding, vacuum lamination, andspin-coating, and the material of the second packaging layer comprisesone of PI, silica gel, and epoxy resin.

Preferably, in the step 8), a method for stripping off the separationlayer and removing the first support substrate comprises one ofmechanical stripping and chemical stripping.

Preferably, the first metal bump and the second metal bump each compriseone of a tin solder, a silver solder, and a gold-tin alloy solder.

Preferably, the width of the first rewiring layer is greater than thewidth of the antenna structure, and the second metal connecting columnis distributed on the first rewiring layer at the periphery of theantenna structure.

Preferably, the second antenna metal layer has a window in an areaaligned with the first antenna metal layer, to prevent the secondantenna metal layer from blocking the first antenna metal layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to. 18 are the cross sectional views of the antenna package inits sequential steps of fabrication according to one embodiment in thepresent disclosure.

FIG. 19 shows the cross sectional view of the completed antenna packageaccording to the present disclosure.

Descriptions of reference numerals 101 First support substrate 102Separation layer 103 Antenna circuit chip 1031 Connecting ports of theantenna circuit chip 105 First rewiring layer 106 Second metalconnecting column 107 Second packaging layer 108 Second antenna metallayer 109 Second metal bump 110 Window 201 Second support substrate 202Stripping layer 203 First antenna metal layer 204 First metal connectingcolumn 205 First packaging layer 206 Second rewiring layer 210 Secondmetal wiring layer?? 211 Second via holes?? 207 First metal bump

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Implementations of the present disclosure are described below by usingparticular and specific examples, and a person skilled in the art caneasily understand other advantages and efficacy of the presentdisclosure from content disclosed in the specification. The presentdisclosure can further be implemented or applied by using otherdifferent specific implementations, details in the specification canalso be based on different opinions and applications, and variousmodifications and changes can be made without departing the spirit ofthe present disclosure.

It should be noted that, figures provided in embodiments describe thebasic idea of the present disclosure only in a schematic manner; onlycomponents related to the present disclosure are shown in the figuresinstead of drawing components based on the quantity, the shape, and thesize of the components required during actual implementation; and theshape, the quantity, and the ratio of each component during actualimplementation can be changed randomly, and the layout shape of thecomponents may be more complex.

As shown in FIGS. 1 to 19, an antenna packaging fabrication method isprovided. The fabrication method comprises the following steps.

As shown in FIG. 1, step 1), providing a first support substrate 101,and forming a separation layer 102 on the first support substrate 101.

In an example, the first support substrate 101 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate. In this embodiment, the firstsupport substrate 101 is a glass substrate. The glass substrate is lowin cost, and it is easy to form the separation layer 102 on a surface ofthe glass substrate, and a difficulty of a subsequent stripping processcan be lowered.

In an example, the separation layer 102 may be an adhesive tape or apolymer layer. The polymer layer is first coated on a surface of thefirst support substrate 101 by using a spin-coating process, and then iscured by using an ultra-violet curing process or a thermal curingprocess.

In this embodiment, the separation layer 102 is thermal curing adhesive.After the thermal curing adhesive is formed on the First supportsubstrate 101 by using the spin-coating process, the thermal curingadhesive is cured by using the thermal curing process. The thermalcuring adhesive has stable performance, and smooth surface, whichfacilitates manufacturing of a subsequent rewiring layer. In addition,in a subsequent stripping process, a stripping difficulty is low.

As shown in FIG. 2, step 2), forming a first rewiring layer 105 on theseparation layer 102, wherein the first rewiring layer 105 comprises afirst surface connected to the separation layer, and a second surfaceopposite to the first surface.

The step 2) of manufacturing the first rewiring layer 105 comprises thefollowing steps.

Step 2-1), forming a dielectric layer on a surface of the separationlayer 102 by using a chemical vapor deposition process or a physicalvapor deposition process, and etch the dielectric layer to pattern thedielectric layer. The material of the dielectric layer may be one ofepoxy resin, silica gel, polyimide (PI), Polybenzoxazole (PBO),Benzocyclobutene (BCB), silica, phosphosilicate glass, andfluorine-containing glass or a combination thereof.

Preferably, the material of the dielectric layer is polyimide (PI), tofurther reduce a process difficulty and process costs.

Step 2-2), forming a metal layer on a surface of the patterneddielectric layer by using a chemical vapor deposition process, anevaporation process, a sputtering process, an electroplating process, oran electroless plating process, and etching the metal layer to patternthe metal wiring layer. The material of the metal wiring layer may beone of copper, aluminum, nickel, gold, silver, and titanium or acombination thereof.

As shown in FIGS. 3 to 11, step 3), providing an antenna structure,where the antenna structure comprises a first packaging layer 205, afirst antenna metal layer 203, a second rewiring layer 206, and a firstmetal bump 207, wherein the first antenna metal layer 203 is disposed ona first surface of the first packaging layer 205, the second rewiringlayer 206 is disposed on a second surface of the first packaging layer205, the first antenna metal layer 203 is electrically connected to thesecond rewiring layer 206 by a first metal connecting column 204 passingthrough the first packaging layer 205, and the first metal bump 207 isformed on the second rewiring layer 206.

The step 3) of providing the antenna structure comprises the followingsteps.

As shown in FIG. 3, step 3-1), providing a second support substrate 201,and forming a stripping layer 202 on the second support substrate 201.

In an example, the second support substrate 201 may be one of a glasssubstrate, a metal substrate, a semiconductor substrate, a polymersubstrate, and a ceramic substrate. In this embodiment, the secondsupport substrate 201 is glass substrate. The glass substrate is low incost, and it is easy to form the stripping layer 202 on a surface of theglass substrate, and a difficulty of a subsequent stripping process canbe lowered.

In an example, the stripping layer 202 may be an adhesive tape or apolymer layer. The polymer layer is first coated on a surface of thesecond support substrate 201 by using a spin-coating process, and thenis cured by using an ultra-violet curing process or a thermocuringprocess.

In this embodiment, the stripping layer 202 is thermocuring adhesive.After the thermocuring adhesive is formed on the second supportsubstrate 201 by using the spin-coating process, the thermocuringadhesive is cured by using the thermocuring process. The thermocuringadhesive has stable performance, and smooth surface, which facilitatesmanufacturing of a subsequent rewiring layer. In addition, in asubsequent stripping process, a stripping difficulty is low.

As shown in FIG. 4 and FIG. 5, step 3-2), forming a first antenna metallayer 203 on the stripping layer 202, and forming a first metalconnecting column 204 on the first antenna metal layer 203.

As shown in FIG. 6 and FIG. 7, step 3-3), wrapping the first antennametal layer 203 and the first metal connecting column 204 by using afirst packaging layer 205, then performing planarization treatment onthe first packaging layer 205, to expose the first metal connectingcolumn 204.

In an example, a method for wrapping the first antenna metal layer 203and the first metal connecting column 204 with the first packaging layer205 comprises one of compression molding, transfer molding, liquid sealmolding, vacuum lamination, and spin-coating, and the material of thefirst packaging layer 205 may be one of PI, silica gel, and epoxy resin.

As shown in FIG. 8, step 3-4), forming a second rewiring layer 206 onthe first packaging layer 205, and forming a first metal bump 207 on thesecond rewiring layer 206, wherein the first metal bump 207 passesthrough the patterned second dielectric layer and is connected to thepatterned metal wiring layer. The first metal bump 207 may be one of atin solder, a silver solder, and a gold-tin alloy solder.

As shown in FIG. 9, step 3-5), separating the second support substrate201 from the first packaging layer 205 based on the stripping layer 202,to expose the first antenna metal layer 203.

As shown in FIG. 10 and FIG. 11, step 3-6), performing cutting to formindividual antenna structures.

As shown in FIG. 12, step 4), bonding the second surface of the firstrewiring layer 105 to the first metal bump 207. For example, the secondsurface of the first rewiring layer 105 may be bonded to the first metalbump 207 by using a welding process.

As shown in FIG. 13, step 5), forming a second metal connecting column106 on the first surface of the first rewiring layer 105, wherein thesecond metal connecting column 106 is not lower than a top surface ofthe antenna structure.

The second metal connecting column 106 is manufactured by using a wirebonding process. The wire bonding process comprises one of a thermalcompression wire bonding process, an ultrasonic wire bonding process,and a thermal compression ultrasonic wire bonding process. The materialof the second metal connecting column 106 may be one of Au, Ag, Cu, andAl. For example, the second metal connecting column 106 is Al, andwelding can be completed at a low temperature by using the ultrasonicwire bonding process, thereby greatly lowering a process temperature. Inanother example, the second metal connecting column 106 may be Au toobtain excellent electrical conductivity performance.

Preferably, the area of the first rewiring layer 105 connecting to thechip 103 is greater than the foot print area of the antenna structure,and the second metal connecting column 106 is distributed on the firstrewiring layer 105 outside the antenna structure.

As shown in FIG. 14 and FIG. 15, step 6), depositing over the antennastructure and the second metal connecting column 106 with a secondpackaging layer 107, then performing planarization treatment on asurface of the second packaging layer 107 to expose a top surface of thesecond metal connecting column 106 from the second packaging layer 107.

In an example, a method for depositing the second packaging layer 107over the antenna structure comprises one of compression molding,transfer molding, liquid seal molding, vacuum lamination, andspin-coating. The material of the second packaging layer 107 comprisesone of PI, silica gel, and epoxy resin.

As shown in FIG. 16, step 7), forming a second antenna metal layer 108on a surface of the second packaging layer 107, wherein the secondantenna metal layer 108 is connected to the second metal connectingcolumn 106.

In this embodiment, the second antenna metal layer 108 has a window 110in an area aligned with the first antenna metal layer 203. The width ofthe window 110 is preferably greater than the width of the first antennametal layer 203, to prevent the second antenna metal layer 108 fromblocking the first antenna metal layer 203, thereby reducing mutualinterference between multiple layers of antennas, and improvingperformance of the multiple layers of antennas.

As shown in FIG. 17, step 8), stripping off the separation layer 102 andremoving the second support substrate 107, to expose the first surfaceof the first rewiring layer 105.

In an example, the second packaging layer 107 and the first supportsubstrate 101 may be separated by mechanical stripping, laser stripping,or chemical stripping (such as wet etching) according to materialproperty of the separation layer 102.

As shown in FIG. 18, step 9), providing an antenna circuit chip 103, andbonding the antenna circuit chip 103 to the first surface of the firstrewiring layer 105. For example, the antenna circuit chip 103 may bebonded to the first surface of the first rewiring layer 105 by welding,so that the antenna circuit chip 103 is electrically connected to thefirst rewiring layer 105.

As shown in FIG. 19, step 10), forming a second metal bump 109 on thefirst surface of the first rewiring layer 105, to achieve electricallead-out of the first rewiring layer 105.

As shown in FIG. 19, an antenna package structure is finally completed,with an antenna circuit chip 103, attached to the first rewiring layer105, a second metal connecting column 106, a second packaging layer 107,a second antenna metal layer 108, and a second metal bump 109.

As shown in FIG. 19, the first rewiring layer 105 comprises a firstsurface and a second surface opposite to the first surface.

In an example, the first rewiring layer 105 comprises a patterneddielectric layer and a patterned metal wiring layer. The material of thedielectric layer may be one or a combination of epoxy resin, silica gel,PI, PBO, BCB, silica, phosphosilicate glass, and fluorine-containingglass. The material of the metal wiring layer may be one or acombination of copper, aluminum, nickel, gold, silver, and titanium.

As shown in FIG. 19, the completed antenna structure comprises a firstpackaging layer 205, a first antenna metal layer 203, a second rewiringlayer 206, and a first metal bump 207, wherein the first antenna metallayer 203 is disposed on a first surface of the first packaging layer205, the second rewiring layer 206 is disposed on a second surface ofthe first packaging layer 205, the first antenna metal layer 203 iselectrically connected to the second rewiring layer 206 by a first metalconnecting column 204 passing through the first packaging layer 205, thefirst metal bump 207 is formed on the second rewiring layer 206, and thefirst metal bump 207 is bonded to the first rewiring layer 105.

In an example, the second rewiring layer 206 comprises a patterned firstdielectric layer xxx, a patterned metal wiring layer xxx, and apatterned second dielectric layer xxx. The first metal bump 207 passesthrough the patterned second dielectric layer and is connected to thepatterned metal wiring layer. The material of the dielectric layer maybe one or a combination of epoxy resin, silica gel, PI, PBO, BCB,silica, phosphosilicate glass, and fluorine-containing glass. Thematerial of the metal wiring layer may be one or a combination ofcopper, aluminum, nickel, gold, silver, and titanium.

In an example, the material of the first metal connecting column 204 maybe one of Au, Ag, Cu, and Al.

In an example, the first metal bump 207 may be one of a tin solder, asilver solder, and a gold-tin alloy solder.

In an example, the width of the first rewiring layer 105 is greater thanthe width of the antenna structure. The second metal connecting column106 is distributed on the second surface of the first rewiring layer 105at the periphery of the antenna structure.

In an example, the material of the first packaging layer 205 may be oneof PI, silica gel, and epoxy resin.

As shown in FIG. 19, the second metal connecting column 106 is formed onthe second surface of the first rewiring layer 105, and the second metalconnecting column 106 is not lower than a top surface of the antennastructure.

As shown in FIG. 19, the second packaging layer 107 wraps the antennastructure and the second metal connecting column 106, and a top surfaceof the second metal connecting column 106 is exposed from the secondpackaging layer 107.

The material of the second packaging layer 107 may be one of PI, silicagel, and epoxy resin.

As shown in FIG. 19, the second antenna metal layer 108 is formed on asurface of the second packaging layer 107, and is connected to thesecond metal connecting column 106.

In an example, the second antenna metal layer 108 has a window 110 in anarea aligned with the first antenna metal layer 203, to prevent thesecond antenna metal layer 108 from blocking the first antenna metallayer 203, thereby reducing mutual interference between multiple layersof antennas, and improving performance of the multiple layers ofantennas.

The second metal bump 109 is formed on the first surface of the firstrewiring layer 105, to achieve electrical lead-out of the first rewiringlayer 105.

In an example, the second metal bump 109 may be one of a tin solder, asilver solder, and a gold-tin alloy solder.

As described above, the present disclosure has the following beneficialeffects:

By using interconnecting multiple rewiring layers, multiple antennametal layers are integrated, multiple antenna package structures can bedirectly interconnected vertically, thereby greatly improving antennaefficiency and performance, and achieving high integration.

By packaging antenna structure with a fan-out packaging method, apackaging volume is effectively reduced, so that the antenna packagestructure achieves high integration and better packaging performance,and has a wide application prospect in the semiconductor packagingfield.

Therefore, the present disclosure effectively overcomes variousdisadvantages in the prior art and has high industrial utilizationvalue.

The foregoing embodiments are merely intended to exemplarily describethe principles and efficacy of the present disclosure and are notintended to limit the present disclosure. A person skilled in the artcan make modifications or changes to the foregoing embodiments withoutdeparting from the spirit and scope of the present disclosure.Therefore, any equivalent modifications or changes completed by a personof common knowledge in the art without departing from the spirit andtechnical thoughts disclosed in the present disclosure shall still fallwithin the scope of the claims of the present disclosure.

The invention claimed is:
 1. An antenna packaging method, comprisingsteps: 1) providing a first support substrate, and forming a separationlayer on the first support substrate; 2) forming a first rewiring layeron the separation layer, wherein the first rewiring layer comprises afirst surface connected to the separation layer and a second surfaceopposite to the first surface; 3) providing an antenna structure,wherein the antenna structure comprises: a first antenna metal layer; afirst packaging layer disposed on the first antenna metal layer, whereinthe first packaging layer is polished on a top surface; a secondrewiring layer, disposed on the polished surface of the first packaginglayer; and a first metal bump, formed on the second rewiring layer; 4)bonding the second surface of the first rewiring layer to the firstmetal bump to attach the antenna structure to the first rewiring layer;5) forming a second metal connecting column on the second surface of thefirst rewiring layer; 6) depositing a second packaging layer over theantenna structure and the second metal connecting column, performingplanarization treatment on a top surface of the second packaging layer,to expose a top surface of the second metal connecting column from thesecond packaging layer, wherein the top surface of the second metalconnecting column is not lower than a top surface of the antennastructure; 7) forming a second antenna metal layer on a top surface ofthe second packaging layer, wherein the second antenna metal layer isconnected to the second metal connecting column; 8) stripping off theseparation layer from the first surface of the first rewiring layer andremoving the first support substrate, to expose the first surface of thefirst rewiring layer; 9) providing an antenna circuit chip with at leasttwo output ports, bonding the antenna circuit chip to the first surfaceof the first rewiring layer and aligning the two output ports to a firstmetal layer of the first rewiring layer; and 10) forming a second metalbump at the first surface of the first rewiring layer, to achieveelectrical lead-out of the first rewiring layer.
 2. The antennapackaging method according to claim 1, wherein the first supportsubstrate comprises one of a glass substrate, a metal substrate, asemiconductor substrate, a polymer substrate, and a ceramic substrate,the separation layer comprises one of an adhesive tape and a polymerlayer, and the polymer layer is first coated on a surface of the firstsupport substrate by using a spin-coating process, and then is cured byusing an ultra-violet curing process or a thermal curing process.
 3. Theantenna packaging method according to claim 1, wherein manufacturing thefirst rewiring layer in step 2) comprises: 2-1) forming a firstdielectric layer on a surface of the separation layer by using achemical vapor deposition process or a physical vapor depositionprocess, and patterning the first dielectric layer to form recesses; and2-2) patterning a first metal wiring layer on a surface of the firstdielectric layer by using a chemical vapor deposition process, anevaporation process, a sputtering process, an electroplating process, oran electroless plating process, followed by etching.
 4. The antennapackaging method according to claim 3, wherein a material of the firstdielectric layer comprises one or a combination of epoxy resin, silicagel, polyimide (PI), PBO, BCB, silica, phosphosilicate glass, andfluorine-containing glass, and a material of the first metal wiringlayer comprises one or a combination of copper, aluminum, nickel, gold,silver, and titanium.
 5. The antenna packaging method according to claim1, wherein the step 3) of providing the antenna structure comprises:3-1) providing a second support substrate, and forming a stripping layeron the second support substrate; 3-2) forming the first antenna metallayer on the stripping layer, and forming a first metal connectingcolumn on the first antenna metal layer, followed by disposing the firstpackaging layer on the first antenna metal layer and the first metalconnecting column, wherein a top surface of the first metal connectingcolumn is exposed from the polished first packaging layer; 3-3)separating the second support substrate from the second packaging layerbased on the stripping layer, to expose the first antenna metal layer;and 3-4) performing die cutting to form individual antenna structures.6. The antenna packaging method according to claim 1, wherein in thestep 5), the second metal connecting column is fabricated by wirebonding, wherein the wire bonding comprises one of a thermal compressionwire bonding process, an ultrasonic wire bonding process, and a thermalcompression ultrasonic wire bonding process, and wherein a material ofthe second metal connecting column comprises one of Au, Ag, Cu, and Al.7. The antenna packaging method according to claim 1, wherein in thestep 6), depositing the second packaging layer comprises one ofcompression molding, transfer molding, liquid seal molding, vacuumlamination, and spin-coating, and a material of the second packaginglayer comprises one of PI, silica gel, and epoxy resin.
 8. The antennapackaging method according to claim 1, wherein in the step 8), strippingoff the separation layer and the first support substrate comprises oneof mechanical stripping and chemical stripping.
 9. The antenna packagingmethod according to claim 1, wherein the first metal bump and the secondmetal bump each comprises one of a tin solder, a silver solder, and agold-tin alloy solder.
 10. The antenna packaging method according toclaim 1, wherein a footprint area of the first rewiring layer under theantenna structure is greater than a footprint area of the antennastructure, and wherein the second metal connecting column is distributedon the first rewiring layer at the periphery of the antenna structure.11. The antenna packaging method according to claim 1, wherein thesecond antenna metal layer has a window in an area aligned with thefirst antenna metal layer, to prevent the second antenna metal layerfrom blocking the first antenna metal layer.